Modular electronic enclosure having rotational molded plastic interlocking components
US6039414A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Dec 11, 1998 |
| Grant date | Mar 21, 2000 |
| Priority date | — |
| Expiry date | Dec 11, 2018 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K7/18
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A modular enclosure includes multiple interlocking molded plastic components and panels to form an exterior structure for the enclosure. The exterior structure provides a protective and aesthetic housing which encloses and covers an interior enclosure housing electronic and mechanical equipment. The exterior interlocking components may be fabricated of plastic utilizing rotationally molding techniques to provide a hollow wall design resulting in structural rigidity and strength to the various external parts and components of the enclosure. The modularity of the present enclosure allows for easy replacement of exterior components without affecting operation of the equipment housed inside the enclosure.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.