Ink jet heater chip module
US6039439A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Jun 19, 1998 |
| Grant date | Mar 21, 2000 |
| Priority date | — |
| Expiry date | Jun 19, 2018 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB41J2002/14387
- WIPO fieldTextile and paper machines
- WIPO sectorMechanical engineering
Abstract
A heater chip module is provided comprising a carrier adapted to be secured to an ink-filled container, at least one heater chip having a base coupled to the carrier, and at least one nozzle plate coupled to the heater chip. The carrier includes a support substrate having at least one passage which defines a path for ink to travel from the container to the heater chip. The heater chip is secured at its base to a portion of the support substrate. At least the portion of the support substrate is formed from a material having substantially the same coefficient of thermal expansion as the heater chip base. A flexible circuit is coupled to the heater chip module such as by TAB bonding or wire bonding.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.