Anisotropic conductive adhesive and method for preparation thereof and an electronic apparatus using said adhesive
US6039896A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Mar 16, 1999 |
| Grant date | Mar 21, 2000 |
| Priority date | — |
| Expiry date | Mar 16, 2019 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/0239
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
An anisotropic conductive adhesive contains conductive particles dispersed in a resin composition, wherein the resin composition includes a radical polymerization resin (A), an organic peroxide (B), a thermoplastic elastomer (C) and a phosphoric ester (D). The resin composition can further contain an epoxy silane coupling agent (E) represented by formula (2) or (3). The resin composition is mixed with other components after the radical polymerization resin (A), the thermoplastic elastomer (C), the phosphoric ester (D) and the epoxy silane coupling agent (E) are reacted. It is also possible to preliminarily react only the phosphoric ester (D) and the epoxy silane coupling agent (E) and to react the product of the preliminary reaction with the radical polymerization resin (A) and the thermoplastic elastomer (C), and then to add other components. The anisotropic conductive adhesive of the present invention can be used for electrical joining of electronic or electric parts of electrical apparatus.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.