Patent · US Expired

Active brazing solder for brazing alumina-ceramic parts

US6039918A · kind A · utility

4Cited by
8References
3Claims
0Family size

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Key dates

Filing dateJul 18, 1997
Grant dateMar 21, 2000
Priority date
Expiry dateJul 18, 2017

Classification

  • Technology area (CPC C)Chemistry; Metallurgy
  • CPC primaryC04B2237/343
  • WIPO fieldMaterials, metallurgy
  • WIPO sectorChemistry

Abstract

The active brazing solder for brazing ceramic parts of alumina, particularly of high-purity alumina, contains a maximum of 12 wt. % Ti, a maximum of 8 wt. % Be, and less than 16.5 wt. % Fe, the remainder being Zr and any impurities that may be present. The active brazing solder has the following behaviour/features: Brazing temperature: lower than 1,000.degree. C.; the brazed joint is high-vacuum-tight over a long period of time; the coefficient of thermal expansion of the active brazing alloy is substantially identical to that of the alumina ceramic in the entire temperature range covered during the brazing process; the strength of the brazed joint between the two ceramic parts is so high that under tensile loading, fracture will result not at the joint, but in the adjacent ceramic; the pressure resistance of the active brazing solder is greater than 2 GPa; the active brazing solder is very good processable into powders having particle sizes on the order of 10 .mu.m.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.