Active brazing solder for brazing alumina-ceramic parts
US6039918A · kind A · utility
Assignees
Inventors
Key dates
| Filing date | Jul 18, 1997 |
| Grant date | Mar 21, 2000 |
| Priority date | — |
| Expiry date | Jul 18, 2017 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC04B2237/343
- WIPO fieldMaterials, metallurgy
- WIPO sectorChemistry
Abstract
The active brazing solder for brazing ceramic parts of alumina, particularly of high-purity alumina, contains a maximum of 12 wt. % Ti, a maximum of 8 wt. % Be, and less than 16.5 wt. % Fe, the remainder being Zr and any impurities that may be present. The active brazing solder has the following behaviour/features: Brazing temperature: lower than 1,000.degree. C.; the brazed joint is high-vacuum-tight over a long period of time; the coefficient of thermal expansion of the active brazing alloy is substantially identical to that of the alumina ceramic in the entire temperature range covered during the brazing process; the strength of the brazed joint between the two ceramic parts is so high that under tensile loading, fracture will result not at the joint, but in the adjacent ceramic; the pressure resistance of the active brazing solder is greater than 2 GPa; the active brazing solder is very good processable into powders having particle sizes on the order of 10 .mu.m.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.