Patent · US Expired

Method of stacking chips with a removable connecting layer

US6040204A · kind A · utility

8Cited by

10References

30Claims

0Family size

Assignee

Robert Bosch GmbH · DE

Inventors

Werner Herden · Gerlingen, DE
Johann Konrad · Eichberg, DE
Hans-Peter Jahn · Neckartenzlingen, DE
Martin Knapp · Kirchentellinsfurt, DE
Hans-Peter Fuessl · Reutlingen, DE
Ning Qu · Beijing, CN

Key dates

Filing date	Aug 28, 1998
Grant date	Mar 21, 2000
Priority date	—
Expiry date	Aug 28, 2018

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2924/0002
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

A method for manufacturing chip stacks in which wafers are stacked one on top of the other. The wafer is provided with an adhesive foil on its bottom, and is subsequently cut into chips so that the adhesive foil remains intact and the chips adhering to the adhesive foil are stacked one on top of the other. A first layer of chips is reversibly attached to a baseplate, the adhesive foil is removed, the next layer of chips is attached to the bottom side of the chips already fastened to the baseplate, the adhesive foil is removed, and the last two steps are repeated until the desired number of chips is stacked one on top of the other.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.