Methods and apparatus for producing integrated circuit devices
US6040235A · kind A · utility
Assignee
Inventor
Key dates
| Filing date | Aug 19, 1996 |
| Grant date | Mar 21, 2000 |
| Priority date | — |
| Expiry date | Aug 19, 2016 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/14
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method for producing integrated circuit devices including the steps of producing a plurality of integrated circuits on a wafer having first and second planar surfaces, each of the integrated circuits including a multiplicity of pads, waferwise attaching to both said surfaces of the wafer a layer of protective material, thereafter partially cutting into the wafer and the protective material attached thereto, thereby to define notches along outlines of a plurality of prepackaged integrated circuit devices, forming metal contacts onto the plurality of prepackaged integrated circuit devices while they are still joined together on the wafer, at least a portion of said metal contacts extending into the notches and thereafter separating the plurality of prepackaged integrated circuit devices into individual devices. Integrated circuits produced according to the method are also disclosed and claimed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.