Method of manufacturing an integrated optical component comprising a thick waveguide coupled to a thin waveguide
US6040246A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Sep 8, 1998 |
| Grant date | Mar 21, 2000 |
| Priority date | — |
| Expiry date | Sep 8, 2018 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01S5/026
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
To form an integrated optical component comprising a thick waveguide coupled to a thin waveguide, the method consists in: depositing a first guiding layer of said thick waveguide on a substrate; locally etching said first guiding layer over a portion allocated both to a coupling interface and to the thin waveguide; depositing a second guiding layer on the first guiding layer and on the locally etched portion so as to form said thick waveguide in a manner such that it has a maximum thickness in a first zone, a graded-thickness section in a second zone, and a reduced-thickness section in a third zone; locally etching the second guiding layer over a portion of the third zone, said portion being allocated to the thin waveguide; and depositing a third guiding layer in said portion of said third zone so as to form said thin waveguide.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.