Curing catalysts for curing epoxy resins
US6040396A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Jul 22, 1997 |
| Grant date | Mar 21, 2000 |
| Priority date | — |
| Expiry date | Jul 22, 2017 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08G59/56
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
A formulation which contains: PA1 (1) the nucleophilic addition adduct of an imidazole and an unsaturated compound, which contains more than one imidazole moiety per molecule; and PA1 (2) an epoxy resin, is characterized in that fewer than 50 equivalent percent of the imidazole moieties in the adduct are neutralized with acid. The adduct may serve as a curing catalyst in high or low-temperature curing. The formulation is made and applied as a powder coating for coatings or as a matrix resin in laminates. It may be used in solvent-borne or liquid systems.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.