High-speed drilling system for micro-via pattern formation, and resulting structure
US6040552A · kind A · utility
Inventors
Key dates
| Filing date | Jan 30, 1997 |
| Grant date | Mar 21, 2000 |
| Priority date | — |
| Expiry date | Jan 30, 2017 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/1545
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
Economical production of laser-drilled high-precision, ultra-miniature multiple-via-hole patterns is accomplished by multiplexing the homogenized, shaped, nearly-collimated output of a high-power excimer laser into a modular set of condenser lens/mask/projection lens beamlines. A substrate delivery subsystem provides a continuous supply of film substrate segments as blanks during production. Functional modularization permits the building and easy retooling of a hard-tooling multiple-beamline system powered by a high-power laser. Vertical modularization permits the building of a single-beamline soft-tooling pilot system, which may be used to demonstrate a production technique, or may be used for short production runs, and which may later be incremented with additional vertical subassemblies for additional beamlines. Multiplexing of the laser output beam into the set of beamlines is accomplished by an illumination module, which may be implemented as a single 100%-reflective fold mirror for a single-beamline pilot system, and can also be implemented as a single-block echelon mirror, or implemented as a multi-beamsplitter set of decreasing-reflectivity mirrors as mirror position approa…
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.