Method of making ceramic substrate
US6041496A · kind A · utility
66Cited by
33References
90Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 11, 1998 |
| Grant date | Mar 28, 2000 |
| Priority date | — |
| Expiry date | Feb 11, 2018 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/24926
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
The present invention relates to multi-layer ceramic packaging of hybrid micro-electronic devices, including those for implantable medical devices. The invention permits size reduction and design simplification in such packaging by eliminating the need for electrolytic or electroless plating, and by eliminating or substantially eliminating the shrinkage variation typically associated with surface metallization techniques.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.