Plasma processing apparatus protected from discharges in association with secondary potentials
US6041733A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Oct 24, 1997 |
| Grant date | Mar 28, 2000 |
| Priority date | — |
| Expiry date | Oct 24, 2017 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01J2237/022
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A plasma processing apparatus such as a plasma etching apparatus, which is not subject to arcing to the gas distributor plate which is caused by secondary potentials generated by polymers adhering to a gas distribution plate. The gas distribution plate is electrically isolated from the ground electric potential, and does not have any polarity. The gas distribution plate may be formed of an insulating material. Furthermore, a support plate may be adapted to fix the gas distribution plate to a chamber of the apparatus in such a manner that the gas distribution plate is detachably coupled with the support plate. Thereby, it is easier to separate the gas distribution plate from the apparatus to remove the accumulated polymers during the plasma process.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.