Non-planar interfaces for cutting elements
US6041875A · kind A · utility
69Cited by
49References
13Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 5, 1997 |
| Grant date | Mar 28, 2000 |
| Priority date | — |
| Expiry date | Dec 5, 2017 |
Classification
- Technology area (CPC E)Fixed Constructions
- CPC primaryE21B10/5735
- WIPO fieldCivil engineering
- WIPO sectorOther fields
Abstract
This invention is directed to cutting elements having an ultra hard cutting layer such as polycrystalline diamond or polycrystalline cubic boron nitride bonded on a cemented carbide substrate. The interface between the substrate and the cutting layer of each such cutting element is non-planar. The non-planar interface is designed to enhance the operating life of the cutting element by reducing chipping, spalling, partial fracturing, cracking and/or exfoliation of the ultra hard cutting layer, and by reducing the risk of delamination of the cutting layer from the substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.