Microsphere containing circuit board paper
US6042936A · kind A · utility
27Cited by
14References
25Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Sep 23, 1997 |
| Grant date | Mar 28, 2000 |
| Priority date | — |
| Expiry date | Sep 23, 2017 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/31663
- WIPO fieldTextile and paper machines
- WIPO sectorMechanical engineering
Abstract
A pre-preg substrate, having a low dielectric constant and containing a substantially uniformly distributed hollow-glass-microsphere filler, and method for making the same. The pre-preg substrate is treated with impregnation and lamination techniques to form a laminate with a low dielectric constant, and good mechanical and electrical properties, suitable as a base material for surface mounted devices in high performance circuits. Improved pre-pregs for making high performance circuit boards and for making surface mounted integrated circuits. Improved high performance circuit boards for making surface mounted integrated circuits.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.