Thick film elements
US6043467A · kind A · utility
Assignee
Inventor
Key dates
| Filing date | May 9, 1997 |
| Grant date | Mar 28, 2000 |
| Priority date | — |
| Expiry date | May 9, 2017 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05B2213/04
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A thick film resistive heating element having a thick film resistive track applied to the surface of an electrically insulative substrate. An encapsulating insulating layer is applied over the track to protect it while an area of the element is left uncovered by the encapsulating layer so as to define a window. A portion of a temperature sensitive control device is then placed in direct contact with the track and/or the electrically insulative substrate through the window. The window in the element is located in that area of the element which will be uncovered by the liquid prior to the rest of the element as the liquid boils away or is evacatuated from the vessel.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.