Substrate tester location clamping, sensing, and contacting method and apparatus
US6043667A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Apr 17, 1997 |
| Grant date | Mar 28, 2000 |
| Priority date | — |
| Expiry date | Apr 17, 2017 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01R31/2831
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A substrate tester and method of testing are disclosed in which the tester moves a substrate to be tested into a precise location within the tester prior to making contact with fragile tester pins. The substrate is then clamped in a precise X-Y location relative to the tester contact pins, also without making contact with the tester pins. Next the substrate top surface is moved quickly to a precise Z-axis location, whereupon the tester contact pins are finally applied to the substrate using Z-axis motion only. In addition, a mechanism is included that features a cam-pivot arm micro-switch combination to sense when a product is not properly positioned in or missing from the test station.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.