Thermal connecting structure for connecting materials with different expansion coefficients

US6043985A · kind A · utility

Assignee

• Max-Planck-Gesellschaft zur Föderung der Wissenschaften e.V. · US

Inventors

• Ghassem Azdasht · Berlin, DE
• Paul Kasulke · Berlin, DE
• Habib Badrihafifekr · Berlin, DE
• Stefan Weiss · Trostberg, DE
• Elke Zakel · Falkensee, DE

Key dates

• Filing date: Nov 7, 1997
• Grant date: Mar 28, 2000
• Expiry date: Nov 7, 2017

Classification

• Technology area (CPC H): Electricity
• CPC primary: H10H20/8585
• WIPO field: Optics
• WIPO sector: Instruments

Abstract

A connecting structure (23) for establishing a thermal connection between at lest two components (21, 22) composed of materials with different expansion coefficients, wherein at least one component forms an electronic power element (21) and higher-melting-point materials are used for the contacting, which higher-melting-point materials form isolated connecting elements (29) between the contact surfaces (27, 28) of the components (21, 22).