LED lamp assembly with means to conduct heat away from the LEDS
US6045240A · kind A · utility
Assignee
Inventor
Key dates
| Filing date | Oct 20, 1997 |
| Grant date | Apr 4, 2000 |
| Priority date | — |
| Expiry date | Oct 20, 2017 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S362/80
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
An electrically driven L.E.D. lamp assembly (14) comprising an electrically insulating circuit board (26) having opposed first and second surfaces with light emitting diodes (28) having positive and negative leads (30, 32) mounted on the first surface. A plurality of holes extend through the board (26) and a plurality of pads (50) of thermally conductive plating are disposed on the second side with each pad (50) associated with the leads to conduct heat from each of the leads to one of the pads (50) while maintaining electrical isolation between the pads. A heat sink includes a base (36) overlying the second surface and an adhesive layer (58) of thermally conductive adhesive is disposed between the conductive plating and the heat sink (36) to secure the conductive plating and the circuit board (26) to the heat sink (36). The assembly is characterized by an electrically non-conductive spacer (56, 156) for preventing contact between the conductive plating (50) and the heat sink to prevent electrical shorting between the conductive plating (50) and the heat sink (36) while maximizing heat transfer. The spacer may comprise a pre-cured coating of the same material as the adhesive (58) o…
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.