Lead frame supplying method and apparatus
US6045318A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Nov 25, 1997 |
| Grant date | Apr 4, 2000 |
| Priority date | — |
| Expiry date | Nov 25, 2017 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/67778
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A lead frame supplying method and apparatus used with, for instance, a wire bonding machine, including a sensor which detects a presence or absence of a lead frame in a frame storing section of a lead frame magazine. The sensor is installed at the level of a frame conveying path or above the level of the frame conveying path of a frame feeder that feeds lead frames to, for instance, the bonding machine and is located so that the lead frame magazine is positioned between the sensor and the frame feeder. In addition, a control unit positions a frame storing section that contains a lead frame at the level of the frame conveying path of the frame feeder when the sensor detects the absence of a lead frame in one frame storing section.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.