Socket apparatus for IC packages
US6045382A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Nov 17, 1997 |
| Grant date | Apr 4, 2000 |
| Priority date | — |
| Expiry date | Nov 17, 2017 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01R1/0433
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
An IC seating portion (14) of a socket (2) for a semiconductor device (300) is arranged so that the IC terminal leads can engage with contact heads (22) of contact pins (20) mounted in the socket. Each contact pin (20) is arranged in a respective slit (8) formed by partition members (7) providing electrically isolation of the contact pins from one another. Socket (2) has a blocking member (3) which blocks the gaps or slits at their top to prevent IC terminal leads from becoming entangled with the slits or contact pins (20). A stop member (4) is formed in the IC seating portion (14) to facilitate positioning of a semiconductor device (300) on the seating portion and to prevent the IC terminal leads from interfering with contact pins (20).
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.