Polycrystalline diamond compact PDC cutter with improved cutting capability
US6045440A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Nov 20, 1997 |
| Grant date | Apr 4, 2000 |
| Priority date | — |
| Expiry date | Nov 20, 2017 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T408/81
- WIPO fieldCivil engineering
- WIPO sectorOther fields
Abstract
The present invention relates to supported polycrystalline diamond compact cutters (PDC cutters) made under high temperature, high pressure (HT/HP) processing conditions, and more particularly to supported PDC cutters having non-planar cutting surfaces. More specifically, the present invention is for an oriented PDC cutter wherein chips and debris are funneled away from the cutting edge by a raised top surface of the polycrystalline diamond layer (PCD layer). The redirection of the debris is achieved by the creation of high and low regions on the PCD layer, of which there can be a variety of different surface geometry's. Thus, an object of the present invention is to provide a PDC cutter with improved performance through channeling debris away from its cutting edge.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.