Process for producing very thin semiconductor chips

US6046073A · kind A · utility

Assignee

• Siemens Aktiengesellschaft · DE

Inventors

• Gunter Lang · Wernau, DE
• Werner Kroninger · Neutraubling, DE

Key dates

• Filing date: Nov 25, 1998
• Grant date: Apr 4, 2000
• Expiry date: Nov 25, 2018

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01L2924/01068
• WIPO field: Semiconductors
• WIPO sector: Electrical engineering

Abstract

The novel process facilitates the production of very thin semiconductor chips with thicknesses down to a few .mu.m. The semiconductor chip is first of all arranged on contact surfaces, with the active side oriented toward the contact surfaces. The chip is then electrically connected to the contact surfaces via contact studs. Silicon is then removed from the exposed rear side of the semiconductor chip during a plasma etching process which has high selectivity with respect to the other materials.