Process and device to cut, perforate or inscribe repeating patterns in continuously-moving flat material

US6046427A · kind A · utility

Assignee

• SIG Combibloc, Inc. · US

Inventors

• Anke Richter · Linnich, DE
• Holger Schmidt · Wuppertal, DE
• Eberhard Schmidt · Wuppertal, DE
• Frank Schmieder · Plauen, DE
• Hans Weiteder · Herzogenrath, DE
• Uwe Kutschki · Jena, DE
• Michael Mosig · Jena, DE
• Michael Nittner · Camburg, DE

Key dates

• Filing date: Aug 6, 1998
• Grant date: Apr 4, 2000
• Expiry date: Aug 6, 2018

Classification

• Technology area (CPC B): Performing Operations; Transporting
• CPC primary: B23K26/142
• WIPO field: Machine tools
• WIPO sector: Mechanical engineering

Abstract

The invention concerns a process to cut, perforate, or inscribe repeating patterns in continuously-moving flat material by locally vaporizing the flat material with at least one controllable laser beam from at least one beam deflection system whereby each laser beam is moved relative to the flat material in two perpendicular directions (x and y) from a fixed point, and a device to implement the procedure. A pattern can be created at any speed that is perfectly aligned in reference to the bent or folded edges by the following steps: Detecting the rate of the flat material, providing bent or folded edges in the moving flat material and detecting its position, controlling the beam deflection system so that it executes the cutting, perforation or writing process depending on a synchronization pulse generated when the bent or folded edges are detected, and the detected rate of the flat material, and monitoring the beam position/beam intensity of each laser beam depending on the detected rate of the flat material and the detected bent or folded edges.