Monolithic integrated circuit die heater and methods for using same
US6046433A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Sep 11, 1998 |
| Grant date | Apr 4, 2000 |
| Priority date | — |
| Expiry date | Sep 11, 2018 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The invention provides an integrated circuit die containing a metal heater resistor. In an embodiment of the invention, the metal heater resistor is disposed around the periphery of the die, with one end of the metal heater resistor connected to a first bond pad, and the other end of the heater resistor connected to a second bond pad. In alternative embodiments, metal-to-substrate contacts disposed along the heater resistor between the first and second ends provide improved thermal contact between the heater resistor and the die substrate. In other alternative embodiments, the metal heater resistor is disposed around the periphery of a circuit whose temperature coefficient is to be measured, such as a voltage reference circuit that is included as part of a larger integrated circuit containing other circuitry.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.