Solder balltape and method for making electrical connection between a head transducer and an electrical lead
US6046882A · kind A · utility
31Cited by
26References
18Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 11, 1996 |
| Grant date | Apr 4, 2000 |
| Priority date | — |
| Expiry date | Jul 11, 2016 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49211
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A solder balltape comprised of an elongated tail with a ball of solder formed at one end. A plurality of the balltape structures are positioned on a carrier strip of solder. The balltape is positioned in contact with a transducer pad on a magnetic read/write slider and an electrical lead pad. A pulse of focused laser radiation is directed at the ball part of the balltape and a right angle fillet joint is formed. A subsequent laser pulse or a sharpened blade is used to remove the tail from the newly formed fillet joint.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.