Pressure sensor component for mounting on the component-mounting surface of a printed circuit board
US6047604A · kind A · utility
9Cited by
0References
15Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 28, 1998 |
| Grant date | Apr 11, 2000 |
| Priority date | — |
| Expiry date | Dec 28, 2018 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2224/48465
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
The pressure sensor component is mountable on the component-mounting surface of a printed circuit board. The component has a chip carrier of electrically insulating material formed with a substantially flat chip carrier surface. A semiconductor chip with a pressure sensor is fastened on the chip carrier surface. Electrode connections with a surface-mountable structure penetrate the chip carrier and they are electrically connected to the semiconductor chip. The chip carrier is filled with a flowable filler completely covering the semiconductor chip.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.