Multi-mode heat transfer using a thermal heat pipe valve
US6047766A · kind A · utility
19Cited by
19References
25Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 3, 1998 |
| Grant date | Apr 11, 2000 |
| Priority date | — |
| Expiry date | Aug 3, 2018 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02D10/00
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
An electronic device has a heat pipe containing a heat transfer fluid. The heat pipe has a first section and a second section. Inside the heat pipe is a valve disposed between the first section and second section of the heat pipe. The valve has an actuator that is used to regulate the flow of the heat transfer fluid between the first section and the second section of the heat pipe in response to a changed state detected by a sensor.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.