Laser bar cleaving apparatus
US6048747A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | May 1, 1998 |
| Grant date | Apr 11, 2000 |
| Priority date | — |
| Expiry date | May 1, 2018 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01S5/0202
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A cleaving apparatus for separating a wafer (or bar) bar of optical devices into separate bars (or individual optical devices) comprises a relatively thin wire, preferably tungsten. The wire is forced against the underside of the bar directly underneath the location of a top side scribe mark. The wire, having a highly uniform, well-controlled radius of curvature, induces a known, reproducible stress through the body of the bar and nucleates a cleavage crack under the scribe mark. A force applied to the top surface of the bar will allow the cleaving crack to propagate cleanly along a single crystal surface through the depth of the bar to the location of the wire.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.