Polybutadiene and polyisoprene based thermosetting compositions and method of manufacture
US6048807A · kind A · utility
Assignee
Inventor
Key dates
| Filing date | Aug 12, 1998 |
| Grant date | Apr 11, 2000 |
| Priority date | — |
| Expiry date | Aug 12, 2018 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T442/3455
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
An electrical substrate material is presented comprising a thermosetting matrix which includes a polybutadiene or polyisoprene resin, an unsaturated butadiene- or isoprene-containing polymer and an ethylene propylene rubber; a particulate filler and, a fabric. Preferred ethylene propylene rubbers are ethylene propylene copolymers and ethylene propylene diene terpolymer rubbers wherein the diene is dicyclopentadiene. The ethylene propylene rubber is present in an amount of up to about 20 wt % with respect to the resin, preferably in an amount of about 1 to about 7 wt %, more preferably about 5 wt %. The presence of the ethylene propylene rubber enhances the dielectric strength of the resulting electrical substrate material, while other electrical, chemical, and mechanical properties of the material are not adversely effected.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.