Thermoplastic molding compounds based on ethylene polymers and thermoplastic polyesters

US6048937A · kind A · utility

Assignee

• BASF SE

Inventors

• Peter Bauer · Ludwigshafen, DE
• Ursula Seeliger · Ludwigshafen, DE
• Uwe Faller · Bischofswerda, DE

Key dates

• Filing date: Jan 20, 1998
• Grant date: Apr 11, 2000
• Expiry date: Jan 20, 2018

Classification

• Technology area (CPC C): Chemistry; Metallurgy
• CPC primary: C08L67/00
• WIPO field: Macromolecular chemistry, polymers
• WIPO sector: Chemistry

Abstract

Thermoplastic molding materials contain, as essential components, PA1 A) from 95 to 99.99% by weight of an ethylene polymer and PA1 B) from 0.01 to 5% by weight of a thermoplastic polyester having a maximum melting point of less than or equal to 150.degree. C.