Laser peening process and apparatus with uniform pressure pulse confinement
US6049058A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Dec 15, 1998 |
| Grant date | Apr 11, 2000 |
| Priority date | — |
| Expiry date | Dec 15, 2018 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02P10/20
- WIPO fieldMaterials, metallurgy
- WIPO sectorChemistry
Abstract
A method and apparatus for improving properties of a solid material by providing shock waves therethrough. Laser shock processing is used to provide the shock waves. The method includes applying a transparent overlay to the solid material to be worked. The solid material or overlay is vibrated to release any gas bubbles or solid debris within the transparent layer which could cause localized non-uniform confinement of a pressure pulse applied for a workpiece thereby causing irregularities in the workpiece surface. A pulse of coherent laser energy is the directed to the coated portion of the solid material to create a shock wave. Additionally, the method may include adding a wetting agent or controlling the temperature of the overlay material to reduce the concentration of gas bubbles therein.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.