Flip chip mounting substrate with resin filled between substrate and semiconductor chip
US6049122A · kind A · utility
68Cited by
3References
15Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Aug 20, 1998 |
| Grant date | Apr 11, 2000 |
| Priority date | — |
| Expiry date | Aug 20, 2018 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K3/3452
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor device and method to control generation of a void within resin during supply to an area between a semiconductor chip and a substrate body. The substrate body includes a wiring layer which is connected to an external bump through internal wiring. Solder resist is formed on the substrate body and an aperture in the solder resist exposes a plurality of pads to electrically connect with the semiconductor chip. During loading of the semiconductor chip, the resin is supplied to the aperture. The aperture is formed in a circumferential shape to control generation of the void.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.