Hermetically sealed tungsten-copper composite package container for packaging of microwave devices
US6049127A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Jun 12, 1998 |
| Grant date | Apr 11, 2000 |
| Priority date | — |
| Expiry date | Jun 12, 2018 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/1423
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method for fabricating a hermetically sealed tungsten-copper package container for a microwave device is provided with the steps of forming an injection feedstock by mixing a polymer binder with a tungsten powder having a particle diameter of 2 to 5 .mu.m and a purity 99.9 of weight percent, forming a three-dimensional part by applying a powder injection molding to the feedstock, obtaining a tungsten skeleton structure by eliminating the binder from the injection molded part, and carrying out a copper infiltration to a copper plate placed on the tungsten skeleton structure for two hours under a hydrogen atmosphere at a temperature of 1250.degree. C. The method incorporates an improved heat sink characteristic, a thermal expansion coefficient similar to that of GaAs, and a capability of applying thereto a strip wire connection, without an extra machining process.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.