Circuit unit and a method for producing a circuit unit
US6049461A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Jul 25, 1996 |
| Grant date | Apr 11, 2000 |
| Priority date | — |
| Expiry date | Jul 25, 2016 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49165
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
A circuit unit having an insulating substrate (1) on which a conductive, flat coil (3) is located. The coil (3) can consist of a plurality of coil layer sections (9, 17) separated by insulating layers (11). To interconnect the individual coil layer sections (9, 17) into a coil, at least one opening (13) is provided in each of the insulating layers (11). The connection between the first coil ends (15, 19) of the coil (3) and an integrated circuit (7) or a module (23) containing the integrated circuit (7) can be formed solely by the coil ends (15, 19) and the connection points (27) of the integrated circuit (7) or the contacts (25) of the module (23) touching. The individual turns of the coil (3) can be disposed and dimensioned so as to permit embossing of the circuit unit without restriction within an area (37, 38) conforming with the standard.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.