Combination electromagnetic shield and heat spreader
US6049469A · kind A · utility
109Cited by
25References
30Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 20, 1997 |
| Grant date | Apr 11, 2000 |
| Priority date | — |
| Expiry date | Aug 20, 2017 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K9/0039
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
An apparatus for providing heat dissipation and electromagnetic shielding for an integrated circuit, such as a CPU, in a computer system includes a first surface thermally coupling the apparatus to an integrated circuit (IC). The apparatus, including the first surface, is of a material, such as some alloys of beryllium copper, with a yield strength of at least 80,000 pounds per square inch and with a thermal conductivity of at least 220 watts/meter*degree (Kelvin). The material is electrically conductive.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.