Patent · US Expired

Calibrating wafer and method for the production of a calibrating wafer

US6050125A · kind A · utility

1Cited by

11References

6Claims

0Family size

Assignee

Siemens Aktiengesellschaft · DE

Inventors

Stefan Geyer · Dresden, DE
Michael Horn · Bath, US
Ralf Gothel · Heidenau, DE
Kathrin Kurth · Dresden, DE

Key dates

Filing date	Aug 27, 1998
Grant date	Apr 18, 2000
Priority date	—
Expiry date	Aug 27, 2018

Classification

Technology area (CPC G)Physics
CPC primaryG01N2001/2893
WIPO fieldMeasurement
WIPO sectorInstruments

Abstract

A calibrating wafer and a method for the production of a calibrating wafer having polymer microspheres. The polymer microspheres are subjected to a heat treatment in a temperature range in which the polymer microspheres start to soften.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.