Patent · US Expired

Extruded, tiered high fin density heat sinks and method of manufacture

US6050332A · kind A · utility

12Cited by

4References

1Claims

0Family size

Assignee

EASTMAN KODAK COMPANY · US

Inventors

Dean L. Smith · Pittsford, US
Edmund J. Sobresky · Batavia, US
Roger S. Kerr · Brockport, US

Key dates

Filing date	Aug 2, 1999
Grant date	Apr 18, 2000
Priority date	—
Expiry date	Aug 2, 2019

Classification

Technology area (CPC Y)Emerging Cross-Sectional Technologies
CPC primaryY10T29/49393
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

An extruded, tiered high fin density heat sink (10) uses extruded first base, second base and bridging elements (12, 16, 14) having an arrangement of closely spaced, parallel fins (20, 26, 32, 38) and recesses (22, 28, 34, 40) for receiving opposing fins in the elements. The fins (20, 38) in the first and second base elements (12, 16) are bonded to recesses (28, 34) in opposite common faces (24, 30) of bridging elements (14) while fins (26, 32) extending from both opposing faces (24, 30) of bridging element (14) are bonded in aligned recesses (22, 40) in the first and second base element (12, 16) forming an extruded, tiered, high fin density heat sink (10).

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.