Aqueous adhesive composition, and bonding process and bonded article making use of the same
US6051097A · kind A · utility
11Cited by
2References
19Claims
0Family size
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Key dates
| Filing date | Feb 4, 1998 |
| Grant date | Apr 18, 2000 |
| Priority date | — |
| Expiry date | Feb 4, 2018 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08F2810/30
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
An aqueous adhesive composition is provided which comprises a water-soluble condensation polymer obtained by subjecting a specific copolymer having an alkoxyl group and a specific alkoxysilane to hydrolysis-condensation, and an aqueous medium containing the condensation polymer. This composition can firmly bond non-sulfur-curable elastomer materials to various adherends such as metals; this has been hitherto difficult. A high-grade adhesion and superior heat resistance and oil resistance can be attained. No organic solvent is contained, promising an environmental safety.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.