Techniques for forming optical electronic integrated circuits having interconnects in the form of semiconductor waveguides
US6051445A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Feb 24, 1999 |
| Grant date | Apr 18, 2000 |
| Priority date | — |
| Expiry date | Feb 24, 2019 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG02B2006/12176
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
An optical electronic integrated (circuit (OEIC) having optical waveguides s device interconnects. An optical waveguide is formed by depositing, in an oxygen-free atmosphere, a film of semiconductor material on a semiconductor substrate at a temperature that substantially diminishes the porosity of the film and the diffusion of material from the substrate into the film. The semiconductor film, which has an index of refraction greater than that of the substrate, is etched to form the optical waveguide on the substrate. The substrate also supports a plurality of active optical devices between which the optical waveguide extends. The substrate is preferably formed from gallium-arsenide and the waveguide from germanium. The active devices may also include these materials as well as aluminum-gallium-arsenide. When using these materials, the germanium film is deposited in an oxygen-free environment at about 100 degrees centigrade.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.