Shaving blade for chip site dressing
US6053393A · kind A · utility
5Cited by
17References
12Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 11, 1999 |
| Grant date | Apr 25, 2000 |
| Priority date | — |
| Expiry date | Mar 11, 2019 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T83/207
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A shaving or shearing blade utilized in dressing solder joint chip technologies without the use of heat or a copper block wicking process. In essence, any solder debris resulting from the solder shaving process as implemented by the shaving blade is removed through the intermediary of a vacuum arrangement located as an integral structure in the shaving blade so as to inhibit the potential formation of electrical shorts or causing solder damage in subsequent replacement chip joins or other assembly operations.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.