Water slide for transferring semiconductor wafers
US6053668A · kind A · utility
1Cited by
1References
22Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 29, 1997 |
| Grant date | Apr 25, 2000 |
| Priority date | — |
| Expiry date | Aug 29, 2017 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/67778
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A water slide for semiconductor wafer processing minimizes water usage by confining water to flow within spaced-apart grooves in the absence of a wafer. When a wafer passes down the water slide, a meniscus of water formed above the grooves is spread out to occupy the space underneath the wafer and prevent it from contacting the water slide as the wafer travels down the water slide.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.