Apparatus for forming transparent conductive film by sputtering and method therefor
US6054024A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Sep 10, 1997 |
| Grant date | Apr 25, 2000 |
| Priority date | — |
| Expiry date | Sep 10, 2017 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02E10/50
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
There are provided a method which, in forming a transparent conductive film by sputtering on a semiconductor junction layer provided on a conductive substrate which bears at least the transparent conductive film thereon, comprises steps of electrically insulating the conductive substrate, and maintaining the self bias voltage Vself of the conductive substrate within a range of -50 V.ltoreq.Vself<0 V, and an apparatus therefor. There can also be reduced the damage to the semiconductor layer, induced by the cations such as Ar.sup.+. Thus there can be produced the photovoltaic elements of a high open-circuit voltage and a high photoelectric conversion efficiency in stable manner.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.