Conformal thermal interface material for electronic components
US6054198A · kind A · utility
112Cited by
35References
19Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 14, 1997 |
| Grant date | Apr 25, 2000 |
| Priority date | — |
| Expiry date | Feb 14, 2017 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/31909
- WIPO fieldBasic materials chemistry
- WIPO sectorChemistry
Abstract
A thermally-conductive interface for conductively cooling a heat-generating electronic component having an associated thermal dissipation member such as a heat sink. The interface is formed as a self-supporting layer of a thermally-conductive material which is form-stable at normal room temperature in a first phase and substantially conformable in a second phase to the interface surfaces of the electronic component and thermal dissipation member. The material has a transition temperature from the first phase to the second phase which is within the operating temperature range of the electronic component.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.