Semiconductor chip and package with heat dissipation
US6054759A · kind A · utility
Assignee
Inventor
Key dates
| Filing date | Jun 5, 1998 |
| Grant date | Apr 25, 2000 |
| Priority date | — |
| Expiry date | Jun 5, 2018 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3025
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor chip is die-bonded on a tape. A plurality of electrodes for power supply for supplying power are formed at an upper surface of the semiconductor chip, and a plurality of electrodes for signal communication for communicating signals are formed at a lower surface of the semiconductor chip. The semiconductor chip, the tape and the like are sealed within a package. A power supply wiring formed external to the package is connected to an electrode for power supply. Thus, a semiconductor device is obtained which efficiently releases the heat generated at the semiconductor chip and contemplates increasing the number of electrodes for signal communication.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.