Large area, multi-device heat pipe for stacked MCM-based systems
US6055157A · kind A · utility
Assignee
Inventor
Key dates
| Filing date | Apr 6, 1998 |
| Grant date | Apr 25, 2000 |
| Priority date | — |
| Expiry date | Apr 6, 2018 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K1/144
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
The invention is a computer module for scalably adding computing power and cooling capacity to a computer system. Computing power can be added by merely adding additional printed circuit cards to the computing module. Cooling capability is added by adding heat pipes to the computer module. The computing module for a computer includes a first heat pipe assembly. The first heat pipe assembly has an evaporator plate with an evaporator surface. The first heat pipe also has a condenser in fluid communication with the evaporator plate. The evaporator plate is positioned adjacent one side of a printed circuit board populated with at least one electronic component. The computing module may use a printed circuit board which has two sides populated with electronic components. When a printed circuit board having components on two sides is used, a second heat pipe having the same construction, namely an evaporator plate with an evaporator surface and a condenser in fluid communication with said evaporator plate, is positioned adjacent the other side of said printed circuit board so that the electronic components on the other side are positioned adjacent said evaporator surface of said second h…
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.