Heat dissipating module for a heat generating electronic component
US6055159A · kind A · utility
Assignee
Inventor
Key dates
| Filing date | Aug 20, 1999 |
| Grant date | Apr 25, 2000 |
| Priority date | — |
| Expiry date | Aug 20, 2019 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A heat dissipating module is adapted for use with an electronic component on one side of a circuit board, and includes a heat sink having a contacting portion to be brought into contact with the electronic component, and a peripheral portion around the contacting portion and formed with a plurality of sink fastener holes that correspond respectively to board fastener holes formed in the circuit board around the electronic component. A back plate is to be disposed adjacent to the other side of the circuit board opposite to the electronic component, and is formed with a plurality of anchoring members that extend through the circuit board via the board fastener holes. Each of a plurality of spring-loaded fasteners has a shank portion, a curved hook portion that extends from the bottom end of the shank portion, and an operating portion that extends transversely from the top end of the shank portion. The shank portion of each fastener extends through a respective sink fastener hole, and the hook portion of each fastener extends through an anchor groove formed in a respective anchoring member for hooking thereon. Each fastener further has a biasing member for urging the heat sink to cont…
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.