Process of fabricating high frequency connections to high temperature superconductor circuits
US6055723A · kind A · utility
4Cited by
7References
6Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 1, 1998 |
| Grant date | May 2, 2000 |
| Priority date | — |
| Expiry date | Jun 1, 2018 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49165
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The invention relates to a method for producing an electrical connection to a high temperature superconductor (HTS) circuit, where a polymer material is applied to the HTS surface covering the circuit contact disposed on one surface of the HTS circuit, a via is created in the polymer material exposing the circuit contact, a diffusion barrier is applied into the via covering the circuit contact; and, a solder bump is applied to the diffusion barrier.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.