Method of preparing end faces on integrated circuits
US6055976A · kind A · utility
6Cited by
7References
8Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 29, 1998 |
| Grant date | May 2, 2000 |
| Priority date | — |
| Expiry date | Jan 29, 2018 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB28D5/022
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A method for preparing operative end faces of integrated circuit chips or dies utilizes a beveled cutting blade to impart a desired contact angle to the operative end faces of the chip. The method includes the steps of mounting feet on the chip, trimming the feet where necessary, mounting the chip on a fixture with tape, cutting the end faces, and removing the chip from the fixture.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.