Heat pipe with improved wick structures
US6056044A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Dec 10, 1997 |
| Grant date | May 2, 2000 |
| Priority date | — |
| Expiry date | Dec 10, 2017 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S165/911
- WIPO fieldThermal processes and apparatus
- WIPO sectorMechanical engineering
Abstract
An improved planar heat pipe wick structure having projections formed by micromachining processes. The projections form arrays of interlocking, semi-closed structures with multiple flow paths on the substrate. The projections also include overhanging caps at their tops to increase the capillary pumping action of the wick structure. The capped projections can be formed in stacked layers. Another layer of smaller, more closely spaced projections without caps can also be formed on the substrate in between the capped projections. Inexpensive materials such as Kovar can be used as substrates, and the projections can be formed by electrodepositing nickel through photoresist masks.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.