Semiconductor wafer carrier having the same composition as the wafers
US6056123A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Dec 9, 1998 |
| Grant date | May 2, 2000 |
| Priority date | — |
| Expiry date | Dec 9, 2018 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/67306
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The described embodiments of the present invention provide a wafer boat that is manufactured using polysilicon. A further embodiment of the invention is a mechanical boat manufacturing technique which avoids the use of welding and other forms of bonding. Another embodiment of the present invention is a polysilicon wafer boat that is formed with a plurality of spaced parallel rods having slots for supporting a series of semi-conductor wafers in a generally edgewise, spaced, parallel position. The rods are mechanically held in place at each end by a plate and capturing mechanism. In yet another embodiment of the invention, polysilicon rods are machined to a tight tolerance with openings in end pieces of the boat. The rods are held firmly in place by polysilicon wedges. This makes for a very rigid structure. If so desired, the boat can then be coated with a layer of polysilicon in a furnace to better lock the parts together.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.