Board to board interconnect
US6056557A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Apr 8, 1998 |
| Grant date | May 2, 2000 |
| Priority date | — |
| Expiry date | Apr 8, 2018 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/10378
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A board-to-board interconnect socket (40) provides electrical interconnection between printed circuit boards (50, 52). Resilient metalized particle interconnects (28) are disposed in holes in a rigid substrate (14) of desired thickness. Each resilient interconnect (28) includes first and second cap members (18, 20) that extend from opposing ends of the hole and beyond the respective surfaces of the substrate. The first and second cap members (18, 20) may be connected with a stem member (22) or conductive paste (34) that is disposed inside the hole. The hole may be lined with conductive material (26) such as conductive plating to facilitate conduction of electricity.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.